POLISHING PADS PRODUCED BY ADDITIVE MANUFACTURING PROCESS

• Main Authors: FU BOYI, CHOCKALINGAM ASHWIN, YAMAMURA MAYU FELICIA, PATIBANDLA NAG B, DAVENPORT ROB, ORILALL MAHENDRA C, KHANNA ANIRUDDH JAGDISH, FUNG JASON G, KUMAR ASHAVANI, HARIHARAN VENKATACHALAM, CORNEJO MARIO, KAKIREDDY RAGHAVA, BAJAJ RAJEEV, NG HOU TEE, SINHA AMRITANSHU, REDFIELD DANIEL, MENK GREGORY E, REDEKER FRED C
• Format: Patent
• Language: Chinese; English
• Published: 20.08.2019
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition ofat least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions. 本公开的实施例是关于具有可调谐化学特性、材料特性及结构特性的高级研磨垫，