Electromigration test structure for solder joint

• Main Authors: CHENG XINGWANG, MA ZHAOLONG, LI CE
• Format: Patent
• Language: Chinese; English
• Published: 16.08.2019
• Subjects: MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

The invention relates to an electromigration test structure for a solder joint. The structure comprises two PCBs, namely, an upper board and a lower board, wherein intermittent middle copper line sections and side copper line sections at two sides are laid on the lower board surface of the upper board, copper line sections corresponding to the lower board surface of the upper board are laid on theupper board surface of the lower board, a pad is laid on each copper line section, green oil is laid in a non-pad position, all pads in the same row of the upper board and the lower board are alignedand are corresponding up and down, to-be-tested solder is welded between pads that are corresponding up and down through a brazing technology, so as to form each to-be-tested solder joint, each middle copper line section in each row and two side copper line sections of the upper board and each copper line section of a corresponding row of the lower board form a conducted line through each to-be-tested solder joint, and an