LASER CUTTING DEVICE AND SUCTION UNIT

• Main Authors: HONG KYONG HO, BAEK JIN WON, SUZUKI TOSHINARU, PAHK JAE BUM, KWON DO KYUN, LEE JIN PYUNG, YI JEONG HO
• Format: Patent
• Language: Chinese; English
• Published: 13.08.2019
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

A laser cutting device according to one embodiment comprises a laser generating unit, an optical unit, a worktable and a suction unit, wherein the laser generating unit generates a laser beam. The optical unit is fixed in an advancing path of the laser beam. The worktable is used for placing a cutting object. Furthermore the suction unit is fixed between the optical unit and the worktable and sucks smoke. The suction unit comprises a body and a pipe which is connected with the body. Furthermore the body comprises an outer box and an inner cup which is fixed in the outer box in a separable manner. 根据一实施方式的激光切割装置包括激光发生单元、光学单元、工作台和吸入单元，其中，激光发生单元产生激光束，光学单元定位在激光束的行进路径上，工作台供放置切割对象物，并且吸入单元定位在光学单元与工作台之间并且吸入烟尘。吸入单元包括本体以及与本体连接的管道，并且本体包括外盒以及以能够分离的方式定位在外盒的内部的内杯。