Manufacturing process of high-planeness COB rigid-flex board

The invention provides a manufacturing process of a high-planeness COB rigid-flex board. The manufacturing process comprises the following steps: 1, performing baking; 2, printing a bonding pad surface; 3, horizontally placing the rigid-flex board obtained at step 2 in a manner that the bonding pad...

Full description

Saved in:
Bibliographic Details
Main Authors PAN CHENHUA, ZHANG DONGZHENG, GUO RUIMING
Format Patent
LanguageChinese
English
Published 09.08.2019
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

More Information
Summary:The invention provides a manufacturing process of a high-planeness COB rigid-flex board. The manufacturing process comprises the following steps: 1, performing baking; 2, printing a bonding pad surface; 3, horizontally placing the rigid-flex board obtained at step 2 in a manner that the bonding pad surface is downward, and baking the rigid-flex board; 4, printing the other side: printing primary ink on the other surface of the rigid-flex board obtained at step 3 by using a screen printing screen; 5, horizontally placing the rigid-flex board obtained at step 4 in a mode that the printing surface is downward, and baking the rigid-flex board; 6, printing ink on the bonding pad surface of the rigid-flex board obtained at step 5 again by using a silk screen board, enabling the ink to face upwards for silent standing, and then horizontally placing and baking the ink with the printing face downwards; 7, naturally placing a release film on the board surface of the rigid-flex board at step 6, placing the rigid-flex bo
Bibliography:Application Number: CN201910389078