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A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over...

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Bibliographic Details
Main Authors OHNO MASAKATSU, IDOJIRI SATORU, YAMAZAKI SHUNPEI, TAKESHIMA KOICHI, ADACHI HIROKI
Format Patent
LanguageChinese
English
Published 23.07.2019
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Summary:A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layerand a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer. 在第一衬底上形成第一有机树脂层,在第一有机树脂层上形成第一绝缘膜,在第一绝缘膜上形成第一元件层,在第二衬底上形成第二有机树脂层,在第二有机树脂层上形成第二绝缘膜,在第二绝缘膜上形成第二元件层,贴合第一衬底与第二衬底,进行使第一有机树脂层与第一衬底之间的附着
Bibliography:Application Number: CN201811573352