System and method for online detecting service life of polishing pad

• Main Authors: GU JINGRAN, LIN SHENGQIANG
• Format: Patent
• Language: Chinese; English
• Published: 19.07.2019
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The invention relates to a system and method for online detecting of service life of a polishing pad. According to the system and the method, the polishing pad with a groove is arranged on the surfaceof a polishing table and rotates along with the polishing table; a polishing head presses a wafer on the surface of the polishing pad and moves relative to the polishing table to flatten the wafer, specifically, a component corresponding to the polishing area is provided with a light source and an optical detector, and the light source emits light beams to the surface of the polishing pad and reflects the light beams to the optical detector; and a controller receives a signal from the optical detector on line, calculates the depth of the groove according to the strength of the signal, and judges the residual working time of the polishing pad. The invention also provides a CMP process parameter on-line adjusting method based on the service life detecting of the polishing pad, wherein the CMP process parameter, suc