Semiconductor memory package

• Main Authors: LEE JONG-JOO, AN HEE-WOO
• Format: Patent
• Language: Chinese; English
• Published: 09.07.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor memory package is provided. The package includes a base substrate, and chip connection pads and external connection pads respectively arranged on upper and lower surfaces of the base substrate; and two semiconductor memory chips mounted on the base substrate each having chip pads electrically connected to the chip connection pads. A first electrical path extends from an external connection pad to a first chip pad of one of the chips and a second electrical path extends from the external connection pad to a second chip pad of another chip, the first and second electrical paths have a common line, the first electrical path has a first branch line and the second electrical path has a second branch line. The base substrate includes an open stub extending from the common line and having an end which is open without being connected to another electrical path. 提供了一种半导体存储器封装件。封装件包括：基底基板以及分别布置在基底基板的上表面和下表面上的芯片连接焊盘和外部连接焊盘；以及安装在基底基板上的两个半导体存储芯片，每个半导体存储芯片具有电连接到芯片连接焊盘的芯片焊盘。第一电路径从外部连接焊盘延伸到芯片中的一个芯片的第一芯片焊盘，第二电