Semiconductor package

A semiconductor package is provided that includes a first substrate having a first surface and a second surface opposite to the first surface; a first semiconductor chip on the first surface of the first substrate; a second semiconductor chip on the first surface of the first substrate; a stiffener...

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Bibliographic Details
Main Author CHO KYONG-SOON
Format Patent
LanguageChinese
English
Published 05.07.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package is provided that includes a first substrate having a first surface and a second surface opposite to the first surface; a first semiconductor chip on the first surface of the first substrate; a second semiconductor chip on the first surface of the first substrate; a stiffener on the first semiconductor chip and the second semiconductor chip; and an encapsulant on the first surface of the first substrate. The first substrate includes a plurality of first pads on the first surface thereof and a plurality of second pads on the second surface thereof. The first semiconductorchip is connected to a first group of first pads of the plurality of first pads. The second semiconductor chip is connected to a second group of first pads of the plurality of first pads. The stiffener covers a space between the first semiconductor chip and the second semiconductor chip. The encapsulant covers at least a sidewall of each of the first and second semiconductor chips and the stiffener. 提供了一种半导体封装件。所述半导体封装件包
Bibliography:Application Number: CN201811610226