Universal direct transfer printing method for transferring micro-nano components from two-dimensional plane to three-dimensional complex surface

• Main Authors: LINGHU CHANGHONG, YOU ZHENYU, LI CHENGLONG, ZHU HAODONG, YU KAIXIN, ZHU JINYE, WANG CHENGJUN, SONG JIZHOU, SU CHENGKAI, ZENG YINJIA
• Format: Patent
• Language: Chinese; English
• Published: 05.07.2019
• Subjects: COLOUR PRINTING; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; STAMPS; TRANSPORTING; TYPEWRITERS

The invention discloses a universal direct transfer printing method for transferring micro-nano components from a two-dimensional plane to a three-dimensional complex surface. The universal direct transfer printing method is realized by using a releasable adhesive tape designed on the basis of paper folding and paper cutting as a transfer stamp. The method comprises the specific transfer printingsteps of 1, dividing the curved surface of a three-dimensional acceptor substrate by using a micro planar unit approximation method, and cutting the curved surface to obtain a planar expanded structure; 2, according to the approximately planar expanded structure obtained in the step 1, designing a component distribution pattern, preparing components, and meanwhile cutting and folding the releasable adhesive tape to obtain releasable adhesive tape folded cut paper; 3, using the releasable adhesive tape folded cut paper to pick up the components from the prepared substrate; 4, coating the three-dimensional acceptor subs