Liquid treatment device

• Main Authors: KITAI TAKAHIRO, MATSUDA GENICHIRO, MIYAKE GAKU, YAMADA YOSHIO, HINO NAOFUMI
• Format: Patent
• Language: Chinese; English
• Published: 18.06.2019
• Subjects: CHEMISTRY; METALLURGY; TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE

The invention provides a liquid treatment device that improves a treatment effect by forcibly contacting a swirl flow of a hydrogen peroxide-containing treated liquid with a liquid to be treated thatcontainS copper ions or iron ions. The liquid treatment device includes a rod-like first electrode (30); a plate-like second electrode (31) formed of a copper- or iron-containing metal; and a first treatment vessel (12) that causes a liquid (L1) to swirl and generate a gas phase (G) in a swirl flow of the liquid (L1). A pulse voltage is applied to the generated gas phase (G) to generate a plasma.The second electrode serves as an anode, and reaches inside of a supply section (80) for a liquid to be treated. The liquid to be treated containing the generated copper ions or iron ions is forciblybrought into contact with hydrogen peroxide generated by the plasma. In this way, the Fenton's reaction effectively takes place, and the liquid treatment performance improves. 本发明提供一种液体处理装置，使包含过氧化氢的处理液的回旋流与预先包含有铜离子或者铁离子的被处理液强制接