SEMICONDUCTOR DEVICE

• Main Authors: TAO HAU, KUO YUNG-TIEN, HSIEH CHENGIEH
• Format: Patent
• Language: Chinese; English
• Published: 04.06.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device includes an interposer disposed on a substrate. A first major surface of the interposer faces the substrate. A system on a chip is disposed on a second major surface of the interposer. The second major surface of the interposer opposes the first major surface of the interposer. A plurality of first passive devices is disposed in the first major surface of the interposer. A plurality of second passive devices is disposed on the second major surface of the interposer. The second passive devices are different devices than the first passive devices. 半导体装置包括设置在衬底上的中介层。中介层的第一主表面面向衬底。系统芯片设置在中介层的第二主表面上。中介层的第二主表面与中介层的第一主表面相对。多个第一无源装置设置在中介层的第一主表面中。多个第二无源装置设置在中介层的第二主表面上。第二无源装置是与第一无源装置不同的装置。