Circuit board and layout structure

• Main Authors: HSU SU-KAI, WANG CHANGUN
• Format: Patent
• Language: Chinese; English
• Published: 28.05.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A circuit board and a layout structure are provided. The layout structure includes a plurality of chip carrying areas, a plurality of inner layer connection pads and a plurality of outer leading wires. The chip carrying areas respectively carry a plurality of chips. The outer leading wires are disposed between the inner layer connection pads and the chip carrying areas. The layout structure is disposed on at least one circuit board and connects to a plurality of wires of the at least one circuit board through the outer leading wires, and the outer leading wires and the wires of the at least one circuit board are formed by sharing at least one metal layer. The circuit board and the layout structure can reduce the cost and the time required by authentication. 本发明提供一种电路板以及布局结构。布局结构包括多个芯片承载区、多个层内导线连接垫以及多条外引导线。芯片承载区用以分别承载多个芯片。层内导线连接垫配置在布局结构的边缘上。外引导线配置在层内导线连接垫与芯片承载区间。其中，布局结构配置在至少一电路板上，并通过外引导线连接至少一第一电路板的多条导线，且外引导线与至少一电路板的导线共用至少一金属层来形成。本发明可减低认证所需的成本及时间。