Glue nozzle cleaning system using electric control back suction valve and cleaning method thereof

The invention belongs to the field of liquid treatment for a glue homogenization process of a wafer in a semiconductor industry, in particular to a glue nozzle cleaning system by using an electric control back suction valve and a cleaning method thereof. The cleaning system involves a glue head, a g...

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Bibliographic Details
Main Authors GAO XIAOXU, GENG KETAO
Format Patent
LanguageChinese
English
Published 28.05.2019
Subjects
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Summary:The invention belongs to the field of liquid treatment for a glue homogenization process of a wafer in a semiconductor industry, in particular to a glue nozzle cleaning system by using an electric control back suction valve and a cleaning method thereof. The cleaning system involves a glue head, a glue nozzle, a glue nozzle cleaning tank, a glue nozzle cleaning pipe, an on-off valve, a glue path heat preservation pipe, the electric control back suction valve and an electric control back suction valve controller; and the glue nozzle is driven by a lifting component to enter the glue nozzle cleaning tank, under action by the electric control back suction valve controller and through controlling the on-off valve, the electric control back suction valve can backwards suck glue nozzle cleaningliquid in a high-precision mode in a cleaning chamber of the glue nozzle cleaning tank, so that the purpose of cleaning the glue nozzle is achieved. According to the system and the method thereof, residual photoresist on the
Bibliography:Application Number: CN201711159619