METHOD FOR BONDING WAFERS

A method is provided and includes the following steps. A first wafer is coupled to a first support of a bonding tool and a second wafer is coupled to a second support of the bonding tool. The second wafer is bonded to the first wafer with the first wafer coupled to the first support. Whether a bubbl...

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Main Authors CHEN TZU-SHIN, HUNG CHUNG-I, YEH SU-YU, CHENG MU-HAN, YANG TSUNG-YI, CHEN CHIENIH
Format Patent
LanguageChinese
English
Published 21.05.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method is provided and includes the following steps. A first wafer is coupled to a first support of a bonding tool and a second wafer is coupled to a second support of the bonding tool. The second wafer is bonded to the first wafer with the first wafer coupled to the first support. Whether a bubble is between the bonded first and second wafers in the bonding tool is detected. 一种晶圆的接合方法，其特征在于，包含以下步骤。将第一晶圆耦接至接合装置的第一支撑座，并将第二晶圆耦接至接合装置的第二支撑座。在第一晶圆耦接至第一支撑座的情况下，将第二晶圆接合至第一晶圆。探测是否有气泡存在于接合装置中该第一晶圆与第二晶圆之间。
Bibliography:Application Number: CN201810671115