High-density phase change memory and preparation method thereof
The invention discloses a high-density phase change memory including a Schottky diode, a phase change layer and an upper electrode from bottom to top. The Schottky diode includes a semiconductor layerand a metal layer forming a Schottky barrier with the semiconductor layer. The metal layer serves as...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
26.04.2019
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | The invention discloses a high-density phase change memory including a Schottky diode, a phase change layer and an upper electrode from bottom to top. The Schottky diode includes a semiconductor layerand a metal layer forming a Schottky barrier with the semiconductor layer. The metal layer serves as a lower electrode of the phase change layer at the same time. The semiconductor layer, the metal layer, the phase change layer and the upper electrode are of a flat layer structure stacked from bottom to top, or the semiconductor layer, the phase change layer and the upper electrode are of a planar structure arranged from bottom to top, the metal layer is connected with a planar bottom surface and a vertical sidewall, the metal layer is overlapped with the semiconductor layer below the metal layer through the bottom surface and is connected to the phase change layer above the metal layer through the sidewall, and the phase change layer is stacked on the upper electrode. The memory can effectively improve the densi |
---|---|
AbstractList | The invention discloses a high-density phase change memory including a Schottky diode, a phase change layer and an upper electrode from bottom to top. The Schottky diode includes a semiconductor layerand a metal layer forming a Schottky barrier with the semiconductor layer. The metal layer serves as a lower electrode of the phase change layer at the same time. The semiconductor layer, the metal layer, the phase change layer and the upper electrode are of a flat layer structure stacked from bottom to top, or the semiconductor layer, the phase change layer and the upper electrode are of a planar structure arranged from bottom to top, the metal layer is connected with a planar bottom surface and a vertical sidewall, the metal layer is overlapped with the semiconductor layer below the metal layer through the bottom surface and is connected to the phase change layer above the metal layer through the sidewall, and the phase change layer is stacked on the upper electrode. The memory can effectively improve the densi |
Author | CHEN SHOUMIAN LI MING ZHONG MIN |
Author_xml | – fullname: CHEN SHOUMIAN – fullname: ZHONG MIN – fullname: LI MING |
BookMark | eNrjYmDJy89L5WSw98hMz9BNSc0rziypVCjISCxOVUjOSMxLT1XITc3NL6pUSMxLUSgoSi1ILEosyczPAwqXZOSnKJRkpBal5qfxMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JJ4Zz9DA0szCzNzU1NHY2LUAACsGzLl |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | 高密度相变存储器及其制备方法 |
ExternalDocumentID | CN109686755A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_CN109686755A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 14:46:49 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | Chinese English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_CN109686755A3 |
Notes | Application Number: CN201811598980 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190426&DB=EPODOC&CC=CN&NR=109686755A |
ParticipantIDs | epo_espacenet_CN109686755A |
PublicationCentury | 2000 |
PublicationDate | 20190426 |
PublicationDateYYYYMMDD | 2019-04-26 |
PublicationDate_xml | – month: 04 year: 2019 text: 20190426 day: 26 |
PublicationDecade | 2010 |
PublicationYear | 2019 |
RelatedCompanies | SHANGHAI IC R&D CENTER CO.,LTD |
RelatedCompanies_xml | – name: SHANGHAI IC R&D CENTER CO.,LTD |
Score | 3.322283 |
Snippet | The invention discloses a high-density phase change memory including a Schottky diode, a phase change layer and an upper electrode from bottom to top. The... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | High-density phase change memory and preparation method thereof |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190426&DB=EPODOC&locale=&CC=CN&NR=109686755A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_mFPVNp6LzgwjSt2Jnvx_KcGnLEOyGTNnbaJqUKdiWrSLzr_fSds4XfQtJCJeDy-8u-d0F4Ca2mUh7nKt2kliqgYGyijNt1XSYoemCmSypCLKRNXw2HqbmtAVv61yYqk7oZ1UcES0qQXsvq_O62Fxi-RW3cnnLXrEr74cTz1ea6BjRDRFH8QdeMB75I6pQ6tFIiZ7Q13UtB51j834LttGNtqU1BC8DmZVS_IaU8AB2xrhaVh5C62vegT26_nmtA7uPzYM3NhvbWx5BX1IyVC4J5-WKFHOEH1Kn7ZJ3SZddkTjjpFiIupp3npH6d2giXTyRp8dwHQYTOlRRktnPtmc02gitn0A7yzNxCsRNBddT02CI7IabprGpcYfHdk8g-ruaOIPu3-t0_xs8h32pQvlWcmddQLtcfIhLhNySXVW6-gb1WYcX |
link.rule.ids | 230,309,783,888,25576,76876 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8gGvFNUaP4VROzt8UB-2APhEg3ggqDGDS8LevaBU3cFpgx-Nd73UB80bembZrrJdffXfu7K8BNYDER1TlXrTA0VR0DZRVnWqrRYrrWFMxgYU6Q9cz-s_4wNaYleFvnwuR1Qj_z4ohoUSHae5af1-nmEsvJuZWLW_aKXUmnN2k7yio6RnRDxFGcbtsdj5wRVShtU0_xntDXtc0WOsfG3RZso4ttSWtwX7oyKyX9DSm9fdgZ42pxdgClr1kVKnT981oVdoerB29srmxvcQgdSclQuSScZ0uSzhB-SJG2S94lXXZJgpiTdC6Kat5JTIrfoYl08UQSHcF1z53QvoqS-D_b9qm3Ebp5DOU4icUJEDsSvBkZOkNk1-0oCgyNt3hg1QWiv62JU6j9vU7tv8ErqPQnw4E_uPcez2BPqlO-mzTMcyhn8w9xgfCbsctcb992kIoK |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=High-density+phase+change+memory+and+preparation+method+thereof&rft.inventor=CHEN+SHOUMIAN&rft.inventor=ZHONG+MIN&rft.inventor=LI+MING&rft.date=2019-04-26&rft.externalDBID=A&rft.externalDocID=CN109686755A |