Halogen-free and high-CTI (comparative tracking index) resin composition for CCL (copper-clad plate)

• Main Authors: JIANG YONGXIN, CHEN SHENGDONG, TANG FENG, YANG LIANHUI, ZHU QUANSHENG, TU FAQUAN, DENG KAIYAN
• Format: Patent
• Language: Chinese; English
• Published: 26.04.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

The invention discloses a halogen-free and high-CTI (comparative tracking index) resin composition for a CCL (copper-clad plate). The composition is prepared from the following main components in terms of organic solids being 100 PHR (parts by weight): (a) 60-80 PHR of a mixture of phosphorus-containing epoxy resin and other epoxy resin, (b)20-40 PHR of a curing agent, (c) 0.01-1 PHR of a curing accelerator, (d) 30-70 PHR of inorganic filler, (e) 3-10 PHR of a phosphorus-containing flame retardant, (f) 0.01-1 PHR of a silane coupling agent and (g) a proper quantity of a solvent. A (copper-cladlaminate prepared from the halogen-free composition has excellent CTI which is higher than or equal to 600 V, also has the advantages of high glass-transition temperature, high heat resistance and the flame retardance reaching UL-94V0 level, and can be widely applied to environment-friendly halogen-free electronic materials such as major appliances, inverters, outdoor charging piles and the likewith high-CTI requirement.