INTEGRATED CIRCUIT PACKAGE HAVING RECTANGULAR ASPECT RATIO

An integrated circuit (IC) packaging arrangement for surface mounting of the IC includes a package body that encapsulates one or more IC dies. The package body according to some embodiments has rectangular aspect ratio with a length dimension and a width dimension of different size. The IC packaging...

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Bibliographic Details
Main Authors KELLAR SCOT A, CREWS DARREN S
Format Patent
LanguageChinese
English
Published 16.04.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit (IC) packaging arrangement for surface mounting of the IC includes a package body that encapsulates one or more IC dies. The package body according to some embodiments has rectangular aspect ratio with a length dimension and a width dimension of different size. The IC packaging according to some embodiments includes leadless surface-mount electrical contacts. According to some embodiments, the leadless surface-mount contacts are situated in clusters at opposite ends of the length dimension of the IC body. 用于IC的表面安装的集成电路(IC)封装布置包括封装个或多个IC管芯的封装主体。根据些实施例的封装主体具有矩形纵横比，该纵横比具有不同大小的长度尺寸和宽度尺寸。根据些实施例的IC封装包括无引线表面安装电触点。根据些实施例，无引线表面安装触点以集群的方式位于IC主体的长度尺寸的相对端处。
Bibliography:Application Number: CN201780052868