Metal bipolar plate and processing method

The present invention provides a metal bipolar plate comprising an anode substrate (1) and a cathode substrate (2), wherein a sealing gasket (3) is disposed between the anode substrate (1) and the cathode substrate (2); a side of the cathode substrate (2) adjacent to the sealing gasket (3) is provid...

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Bibliographic Details
Main Authors WANG LISHENG, WANG HAIFENG, DONG WENCHAO, QIAN CONG
Format Patent
LanguageChinese
English
Published 02.04.2019
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Summary:The present invention provides a metal bipolar plate comprising an anode substrate (1) and a cathode substrate (2), wherein a sealing gasket (3) is disposed between the anode substrate (1) and the cathode substrate (2); a side of the cathode substrate (2) adjacent to the sealing gasket (3) is provided with a cooling water runner plate (4); the other side of the cathode film (2) is provided with acathode runner plate (5); and an anode runner plate (14) is disposedon a side of the anode substrate (1) opposite to the sealing gasket (3). The metal bipolar plate of the invention is different froman integrated punched bipolar plate in the prior art, the substrates and the runner plate are assembled separately, and no expensive punching die equipment is needed, thereby avoiding hidden dangers such as material internal stress concentration and workpiece cracking during the punch forming, and achieving low production cost and a simple process flow, and a high practical value. 本发明提供种金属双极板,包括:阳极底片(1)、阴极底片(2);所述阳极底片(1)与所
Bibliography:Application Number: CN201910005519