Semiconductor Die Bond Pad with Insulating Separator

• Main Authors: LAUMER BERNHARD, BRETTHAUER CHRISTIAN, POEHLE HOLGER, STAVREV MOMTCHI
• Format: Patent
• Language: Chinese; English
• Published: 26.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a semiconductor die bond pad with an insulating separator. The semiconductor die includes a last metallization layer above a semiconductor substrate, a bond pad above the last metallization layer, a passivation layer covering part of the bond pad and having an opening that defines a contact area of the bond pad, an insulating region separating the bond pad from the last metallization layer at least in an area corresponding to the contact area of the bond pad, and an electrically conductive interconnection structure that extends from the bond pad to the upper metallization layer outside the contact area of the bond pad. Corresponding methods of manufacture are also provided. 具有绝缘分离体的半导体管芯接合焊盘。种半导体管芯包括在半导体衬底上方的最后金属化层；在最后金属化层上方的接合焊盘；保护层，其覆盖接合焊盘的部分并且具有限定接合焊盘的接触区的开口；绝缘区域，其至少在与接合焊盘的接触区相对应的区中将接合焊盘与最后金属化层分离；以及导电互连结构，其在接合焊盘的接触区的外部从接合焊盘延伸到上金属化层。还提供了相应的制造方法。