Semiconductor wafer processing method and system and system cleaning method

• Main Authors: LU MIN'AN, ZHENG BOZHONG, LI ZONGYAN, GUO JUEQI, XU ZHEZHANG, ZHOU JIAXIN, CHEN LIRUI, FU ZHONGQI
• Format: Patent
• Language: Chinese; English
• Published: 26.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY

An embodiment of the invention provides a semiconductor wafer processing method and system and a system cleaning method. The system cleaning method comprises a step of placing a cleaning device over amask electrostatic seat in a vacuum chamber. A polymer material layer of the cleaning device is adsorbed to the mask electrostatic seat by the mask electrostatic seat. The cleaning device is separated from the mask electrostatic seat when the cleaning device is adsorbed to the mask electrostatic seat for a first time. 本公开实施例提供种半导体晶圆加工方法、系统及系统的清洁方法。上述半导体晶圆加工系统的清洁方法包括在真空腔室中，将清洁装置放置于掩模静电座上方。通过上述掩模静电座将上述清洁装置的聚合物材料层吸附于上述掩模静电座。当上述清洁装置吸附于上述掩模静电座且经过第时间时，将上述清洁装置与上述掩模静电座分离。