DEVICE FOR COOLING POWER ELECTRONICS CIRCUIT

• Main Authors: CRESPO THIERRY, BOURLIER LUDOVIC, COURAGE AURELIEN
• Format: Patent
• Language: Chinese; English
• Published: 15.03.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

Device (1) for cooling at least one power electronics circuit (4) includes: a liquid-cooled heatsink (2); and an interface plate (3) that is in thermal contact with the heatsink (2) and to which the one or more power electronics circuits (4) are attached, the interface plate (3), including at least...