DEVICE FOR COOLING POWER ELECTRONICS CIRCUIT

Device (1) for cooling at least one power electronics circuit (4) includes: a liquid-cooled heatsink (2); and an interface plate (3) that is in thermal contact with the heatsink (2) and to which the one or more power electronics circuits (4) are attached, the interface plate (3), including at least...

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Bibliographic Details
Main Authors CRESPO THIERRY, BOURLIER LUDOVIC, COURAGE AURELIEN
Format Patent
LanguageChinese
English
Published 15.03.2019
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Device (1) for cooling at least one power electronics circuit (4) includes: a liquid-cooled heatsink (2); and an interface plate (3) that is in thermal contact with the heatsink (2) and to which the one or more power electronics circuits (4) are attached, the interface plate (3), including at least one thermosiphon (6), being removably mounted on the heatsink (2) so as to be capable of being separated therefrom with the one or more electronic circuits (4) attached thereto. 用于冷却至少个电力电子电路(4)的装置(1)，该装置(1)包括：液体冷却式散热器(2)；以及与散热器(2)热接触的接口板(3)，在接口板(3)上附接有个或更多个电力电子电路(4)，所述接口板(3)包括至少个热虹吸管(6)，所述接口板(3)可移除地安装在散热器(2)上使得能够在所述接口板(3)上附接有个或更多个电子电路(4)的情况下与散热器(2)分离。
Bibliography:Application Number: CN201780043781