Ultra-thin image sensor module

• Main Authors: ZHANG JINGCHAO, SONG DEREN
• Format: Patent
• Language: Chinese; English
• Published: 12.03.2019
• Subjects: ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION

The invention discloses an ultra-thin image sensor module which comprises a sensor body. A lens is arranged in an embedding mode at the right side inside the sensor body; a base is arranged in an embedding mode at the left side of the lens and in the sensor body; the base is matched and clamped with a reflector; the reflector is clamped and fixed on the base and is inclined towards the left side;a light source is arranged in an embedding mode in the sensor body and at the left side of the base; and a wafer is arranged in an embedding mode at the right side inside the sensor body. According tothe invention, in a case of not influencing scanning quality, an overall thickness of an image sensor can be reduced, which is beneficial for a client to design a smaller size in overall mechanism size design and can reach an optimal space utilization rate; compared to a thickness of an image sensor produced in the prior art, a thickness of the ultra-thin image sensor module disclosed by the novel invention is reduced by