A method for bin a flexible circuit board and a flexible circuit board
The invention discloses a flexible circuit board binding processing method and a flexible circuit board. The flexible circuit board binding processing method comprises the following steps: identifyinga first pair of coordinates on a flexible circuit board auxiliary binding area and a second pair of...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
12.03.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a flexible circuit board binding processing method and a flexible circuit board. The flexible circuit board binding processing method comprises the following steps: identifyinga first pair of coordinates on a flexible circuit board auxiliary binding area and a second pair of coordinates on a main binding area; Identifying a first pair of markers and a second pair of markers on the touch display glass; Binding the flexible circuit board to the touch display glass, wherein a first pair of coordinates on the touch display glass coincides with a first pair of coordinates on the flexible circuit board auxiliary binding area, and a second pair of coordinates on the touch display glass coincides with a second pair of coordinates on the flexible circuit board main bindingarea. The scheme provided by the invention can realize automatic binding even under the condition that the binding positioning is very small, and the binding efficiency is improved.
本发明公开种柔性电路板绑定处理方法及柔性电路板。该柔性电路板绑定处理方法包括:识别柔性电 |
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Bibliography: | Application Number: CN201811359245 |