Electronic packaging structure, packaging substrate and preparation method thereof

• Main Authors: MI HSUAN HAO, CHEN CHIA CHENG, WU QIRUI, LIN CHUN HSIEN, PAI YU CHENG
• Format: Patent
• Language: Chinese; English
• Published: 05.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides an electronic packaging structure, a packaging substrate and a preparation method thereof. The invention provides the packaging substrate which comprises an insulating part, a line part which is combined with the insulating part, and a supporting member arranged on the insulat...