Electronic packaging structure, packaging substrate and preparation method thereof
The invention provides an electronic packaging structure, a packaging substrate and a preparation method thereof. The invention provides the packaging substrate which comprises an insulating part, a line part which is combined with the insulating part, and a supporting member arranged on the insulat...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
05.03.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The invention provides an electronic packaging structure, a packaging substrate and a preparation method thereof. The invention provides the packaging substrate which comprises an insulating part, a line part which is combined with the insulating part, and a supporting member arranged on the insulating part. Furthermore the supporting member has an opening which exposes part of the line part so that a testing device can perform electric testing on the line part before executing a crystal packaging process, thereby determining whether the electric property of the packaging substrate is defective and preventing arranging a good wafer on a defective packaging substrate.
种电子封装结构及其封装基板与制法,其提供包含有绝缘部、结合于该绝缘部的线路部及设于该绝缘部上的支撑件的封装基板,且该支撑件具有外露部分该线路部的开口,使检测装置能于进行置晶封装制程前针对该线路部进行电测,以得知该封装基板的电性是否不良,避免将良好的晶片设于不良的封装基板上。 |
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Bibliography: | Application Number: CN20171826338 |