Electronic packaging structure, packaging substrate and preparation method thereof

• Main Authors: MI HSUAN HAO, CHEN CHIA CHENG, WU QIRUI, LIN CHUN HSIEN, PAI YU CHENG
• Format: Patent
• Language: Chinese; English
• Published: 05.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides an electronic packaging structure, a packaging substrate and a preparation method thereof. The invention provides the packaging substrate which comprises an insulating part, a line part which is combined with the insulating part, and a supporting member arranged on the insulating part. Furthermore the supporting member has an opening which exposes part of the line part so that a testing device can perform electric testing on the line part before executing a crystal packaging process, thereby determining whether the electric property of the packaging substrate is defective and preventing arranging a good wafer on a defective packaging substrate. 种电子封装结构及其封装基板与制法，其提供包含有绝缘部、结合于该绝缘部的线路部及设于该绝缘部上的支撑件的封装基板，且该支撑件具有外露部分该线路部的开口，使检测装置能于进行置晶封装制程前针对该线路部进行电测，以得知该封装基板的电性是否不良，避免将良好的晶片设于不良的封装基板上。