Adhesive film for encapsulation material of organic electronic device and encapsulation material for organic electronic device comprising same

• Main Authors: ROH JUNG-SUB, KIM JOON-HO, CHOI CHANG-HWON, LEE SANG-PIL, KONG LEE-SEONG, PARK SOONUN
• Format: Patent
• Language: Chinese; English
• Published: 05.03.2019
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

The invention relates to an adhesive film for an encapsulating material of an organic electronic device and an encapsulating material for an organic electronic device comprising the same, and more particularly to an adhesive film for an organic electronic device and an encapsulating material for an organic electronic device comprising the same, that is, to make it impossible to access the organicelectronic device through the removal and blocking of undesirable substances such as moisture and impurities, and to have an excellent effect of moisture resistance and heat resistance without causingan interlayer peeling phenomenon which may occur when moisture is removed. 本发明涉及有机电子设备封装材料用粘结膜及包括其的有机电子设备用封装材料，更详细地涉及如下的有机电子设备用粘结膜及包括其的有机电子设备用封装材料，即，通过去除及阻隔水分、杂质等不良原因物质使得无法接近有机电子设备，并且不发生当去除水分时可产生的层间剥离现象的同时，具有耐湿性及耐热性优秀的效果。