SEMICONDUCTOR MANUFACTURING DEVICE AND METHOD OF POLISHING SEMICONDUCTOR SUBSTRATE

• Main Authors: TOSHIKAWA KIYO, HIKOBABA HIROYUKI
• Format: Patent
• Language: Chinese; English
• Published: 05.03.2019
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

The present invention relates to a semiconductor manufacturing device which prevents the occurrence of a problem caused by a variation in the depth of a groove formed on a surface of a polishing pad.There is provided a semiconductor manufacturing device including: a polishing head that is capable of retaining a semiconductor substrate; a polishing pad having a processing surface to be abutted tothe semiconductor substrate retained by the polishing head, the processing surface including a groove; a platen that is capable of rotating about a rotary shaft running along a direction intersectingthe processing surface, in a state in which the polishing pad is retained by the platen; a measuring section that is configured to output a measurement value indicating a height of the processing surface at a predetermined location along a circumference of a circle centered about the rotary shaft of the platen; and a derivation section that is configured to derive a depth of the groove from the measurement value of the meas