Method for joining a substrate and a part with structuring of the substrate

• Main Authors: KUPISIEWICZ AXEL, MORALES CID GABRIEL, RAMOS DE CAMPOS JOSE ANTONIO, GONZALEZ HIGUERAS RAFAEL, HENROTTIN ANNE, NAVAS MARTOS FRANCISCO JAVIER
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2019
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The present invention relates to a method for joining a substrate (11) with a part (14) comprising a step of structuring the substrate with a pulsed laser (31), the substrate (11) preferably being made of metal and the part preferably being polymer-based. The structuring step allows grooves to be etched into the substrate (11) in a pattern (17) determined by the relative movement (41) of the beam(32) and the substrate (11). The pattern (17) is designed so as to allow an excellent adhesion to be achieved between the structured substrate (12) and a part (14) after the substrate (12) and the part (14) have been joined by laser welding (130). Preferably, the joining method comprises a step (50) of pre-treating the structured surface in order to allow better absorption of the laser during thejoining by welding. 本发明涉及种用于将基板(11)与部件(14)接合的方法，包括用脉冲激光器(31)结构化基板的步骤，基板(11)优选地由金属制成，并且部件优选地是以聚合物为基础的。该结构化步骤允许以通过光束(32)与基板(11)的相对移动(41)确定的图案(17)的形式将凹槽蚀刻到基板(11)中。图案(17)被设计成允许在基板(12)与部件(14)已经通过激光焊接(130)接合之后在结构化基板(12)与部件(14)之间实现良好