Fan-out semiconductor package

• Main Authors: KIM DOO IL, HUR YOUNG SIK, BAEK YONG HO, SO WON WOOK
• Format: Patent
• Language: Chinese; English
• Published: 01.03.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A fan-out semiconductor package includes: a core member including a plurality of insulating layers and a plurality of wiring layers and having a blind cavity penetrating through a portion of the plurality of insulating layers; a semiconductor chip disposed in the blind cavity; an encapsulant encapsulating at least portions of the core member and an active surface of the semiconductor chip and filling at least portions of the blind cavity; and a connection member disposed on the core member and an active surface of the semiconductor chip and including a redistribution layer connected to the connection pads. The plurality of wiring layers include antenna patterns and ground patterns, the antenna patterns and the ground patterns are disposed on different levels, and the antenna patterns are connected to the connection pads through the redistribution layer. 本公开提供种扇出型半导体封装件，所述扇出型半导体封装件包括：芯构件，包括多个绝缘层和多个布线层并且具有贯穿所述多个绝缘层的部分的盲腔；半导体芯片，设置在所述盲腔中；包封剂，包封所述芯构件的至少部分和所述半导体芯片的有效表面的至少部分并且填充所述盲腔的至少部分；及连接构件，设置在所述芯构件和所述半导体芯片的所述有效表