Component embedded in component carrier and having an exposed side wall

The invention provides a component carrier (100) and a method for manufacturing the same. The component carrier comprises a stack (102) comprising a plurality of electrically conductive layer structures (104) and/or electrically insulating layer structures (106), and a component (108) embedded in th...

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Main Authors ZLUC ANDREAS, SCHUSTER BETTINA, LEITGEB MARKUS, STAHR HANNES, SILVANO DE SOUSA JONATHAN
Format Patent
LanguageChinese
English
Published 26.02.2019
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:The invention provides a component carrier (100) and a method for manufacturing the same. The component carrier comprises a stack (102) comprising a plurality of electrically conductive layer structures (104) and/or electrically insulating layer structures (106), and a component (108) embedded in the stack (102), wherein at least a portion of a side wall (110) of the component (108) is exposed. 提供了种部件承载件(100)及制造该部件承载件的方法。该部件承载件包括：堆叠体(102)，该堆叠体包括多个导电层结构(104)和/或电绝缘层结构(106)；以及部件(108)，该部件嵌入在该堆叠体(102)中，其中，部件(108)的侧壁(110)的至少部分暴露。
Bibliography:Application Number: CN201810878356