Distributed chassis, management method and device of distributed chassis
The invention provides a distributed chassis, a management method and device of the distributed chassis. The distributed chassis comprises a main control board, a power supply board, a fan board and at least one service board. A plurality of service chips are arranged on the service board for realiz...
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| Main Authors | , , |
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| Format | Patent |
| Language | Chinese English |
| Published |
26.02.2019
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| Subjects | |
| Online Access | Get full text |
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| Summary: | The invention provides a distributed chassis, a management method and device of the distributed chassis. The distributed chassis comprises a main control board, a power supply board, a fan board and at least one service board. A plurality of service chips are arranged on the service board for realizing the service functions of the chassis. The fan board card is used for driving the fan in the chassis to dissipate heat. The power board is used for supplying power to other boards in the chassis. A main control board, a power supply board, a fan board and a service board are provided with a micro-control module and a temperature sensor, and that temperature sensor on each board are use for collecting the temperature values of preset temperature collection points on each board. The main control board is respectively connected with the power board, the fan board and the service board, and controls the fan board to dissipate heat according to the temperature values collected by other boardsand the temperature value |
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| Bibliography: | Application Number: CN201811489935 |