Packaging substrate, LED device, LED module and manufacturing method of LED module

• Main Authors: ZHU WENMIN, XIAO GUOWEI, WAN CHUIMING, LI ZHENZHEN, ZENG ZHAOMING
• Format: Patent
• Language: Chinese; English
• Published: 15.02.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention discloses a packaging substrate, an LED device, an LED module and a manufacturing method of the LED module. The packaging substrate comprises a first electrode, a second electrode and aninsulation isolation region; the insulation isolation region is arranged between the first electrode and the second electrode; the first electrode is provided with a first convex part and a second convex part; the second electrode is provided with a third convex part; the first convex part of the first electrode, the second convex part of the first electrode and the third convex part of the second electrode are arranged in a staggered mode; a first side wall of the insulation isolation region is provided with a first concave part and a second concave part; a second side wall is provided witha third concave part; the first concave part is matched with the first convex part; the second concave part is matched with the second convex part; and the third concave part is matched with the thirdconvex part, so that the c