Low-temperature cured copper alloy conducting resin and preparation method thereof

• Main Authors: HE BO, MA AILI, LIN JUNXIU, NING RUI, JIAO QINGZE
• Format: Patent
• Language: Chinese; English
• Published: 15.02.2019
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

The invention discloses low-temperature cured copper alloy conducting resin. The low-temperature cured copper alloy conducting resin is prepared from the following raw materials in parts by weight: 100 parts of epoxy resin, 15-25 parts of a curing agent, 12-20 parts of a diluent, 5-25 parts of a plasticizer and 60-85 parts of conducting filler. The curing agent is one or two of formamide and N,N-dimethylformamide. The conducting filler is microscale copper alloy powder which is prepared from the following elements in percent by weight: 0.6-1.5wt% of Cr, 0.5-2wt% of Ag, 0.1-0.8wt% of Zr, 0.2-0.6wt% of Ce and the balance Cu. The invention also discloses a preparation method of the conducting resin. The conducting resin disclosed by the invention can be cured quickly at a low temperature, andhas a certain advantage in improving the operability and production efficiency of the conducting resin and lowering the cost of the conducting resin. 本发明公开了种低温固化铜合金导电胶，由下述重量份原料制成：环氧树脂100份、固化剂15-25份、稀释剂12-20份、增塑剂5-25份、导电填料60-