Package structure and method of fabricating the same

• Main Authors: YU CHEN-HUA, CHEN CHIEH-YEN, TANG TZUUN, CHEN WEI-TING, WANG CHUEI-TANG
• Format: Patent
• Language: Chinese; English
• Published: 12.02.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A package structure has a chip, a molding compound encapsulating the chip and an inductor structure disposed above the chip. A vertical projection of the inductor structure at least partially overlapswith a vertical projection of the chip. 种封装结构具有芯片、包封所述芯片的模塑化合物以及设置在所述芯片上方的电感器结构。所述电感器结构的垂直投影至少局部地与所述芯片的垂直投影交叠。