LIQUID COOLING SYSTEM AND METHOD

• Main Authors: DE-CANDIDO ERIKA, KIPFER MANFRED, GARDONI IRENE
• Format: Patent
• Language: Chinese; English
• Published: 05.02.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

A liquid cooling system (10) for cooling at least one electrical component (14) is provided, the liquid cooling system (10) comprising a cooling circuit (12) having at least one supply branch (20) forsupplying liquid coolant to an electrical component (14); and at least one deaeration line (28) to provide a connection between a high point (32) and a junction point (34) of the cooling circuit (12)to bypass a part of the cooling circuit (12); wherein the pressure of the liquid coolant is lower in the junction point (34) than in the high point (32) during circulation of the liquid coolant in the liquid cooling system (10). 用于使至少个电气部件(14)冷却的液体冷却系统(10)，所述液体冷却系统(10)包括：冷却回路(12)，具有用于向电气部件(14)供应液体冷却剂的至少个供应分支(20)；以及至少个除气管线(28)，用以提供所述冷却回路(12)的高点(32)与接合点(34)之间的连接，以绕过所述冷却回路(12)的部分；其中在所述液体冷却剂在所述液体冷却系统(10)中的循环期间，所述液体冷却剂在所述接合点(34)中的压力比在所述高点(32)中的压力低。