Hard-to-hard-attaching binding device under vacuum negative pressure state of sealed frames
The invention relates to a hard-to-hard-attaching binding device under a vacuum negative pressure state of sealed frames. The hard-to-hard-attaching binding device under the vacuum negative pressure state of the sealed frames comprises lower die cavity Y-axis displacement modules, lower die cavity X...
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Main Authors | , |
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Format | Patent |
Language | Chinese English |
Published |
01.02.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a hard-to-hard-attaching binding device under a vacuum negative pressure state of sealed frames. The hard-to-hard-attaching binding device under the vacuum negative pressure state of the sealed frames comprises lower die cavity Y-axis displacement modules, lower die cavity X-axis displacement modules, lower die sealed frames, vacuum gas circuit control systems, rotating shafts, heating plates, product positioning platforms, upper die cavity up-and-down-moving mechanisms, upper die sealed frames, feeding platform Y-axis displacement modules, feeding platforms, camera moving X/Y displacement modules, CCD prism modules, a high-vacuum assembly, a shell, a linear drive and vacuum boxes. The lower die cavity Y-axis displacement modules are disposed at the top of a base,and the lower die sealed frames are mounted on the lower die cavity X-axis displacement modules. According to the hard-to-hard-attaching binding device under the vacuum negative pressure state of thesealed frames, product inp |
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Bibliography: | Application Number: CN201811250911 |