Wafer-level packaging structure for surface acoustic wave device and packaging method thereof

• Main Authors: LIANG LIUHONG, XU YANG, JIANG PINGYING, MA JINYI, TIAN BENLANG, DU BO, LIU YA, SUN KE, MI JIA, JIANG XIN, LONG FEI, YANG ZHENGBING
• Format: Patent
• Language: Chinese; English
• Published: 29.01.2019
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

The invention discloses a wafer-level packaging structure for a surface acoustic wave device, which comprises a functional wafer and a capping wafer, wherein the capping wafer is provided with convexbonding step portions facing towards the peripheral area of the working surface of each functional chip, and the capping wafer and the functional chips are bounded together through the bonding step portions; and a connecting portion of a circuit on the working surface of each functional chip is connected with an external electrode through a conduction hole. Compared with the prior art, the functional wafer and the capping wafer in the invention are directly bonded without polymer frame bonding, so that the processing is reduced, and the reliability of the device can be improved. The inventionfurther discloses a packaging method of the wafer-level packaging structure for the surface acoustic device. According to the method, the functional wafer does not need to be cut into single chips, the whole functional wafer i