Pollution-free electroplating solution and preparation method thereof

• Main Authors: SU BO-YAN, LI CHUN-YING, PENG KUN-ZENG, LI MING-REN, ZENG YAO-TIAN
• Format: Patent
• Language: Chinese; English
• Published: 25.01.2019
• Subjects: APPARATUS THEREFOR; CHEMISTRY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS

This disclosure discloses a pollution-free electroplating solution and a preparation method thereof. The process of the preparation method includes: mixing choline chloride with nitrogenous compoundsin molar ratio of 1:2, heating the mixture to 80 DEG C to form uniform ionic liquid, adding metal chloride into ionic liquid with molar concentration between 0.005M to 0.5 M, stirring the ionic liquidwith the metal chloride, adding 7-11 wt % of bio bacteria and 0.7M-2M of inorganic acid agent into the ionic liquid with the metal chloride, stirring the ionic liquid with the bio bacteria and the inorganic acid agent, and obtaining the pollution-free electroplating solution. 本发明公开种无污染电镀液及其制备方法，其制备方法的步骤包括：首先，混合氯化胆碱和含氮化合物，并加热至80摄氏度形成离子液体，氯化胆碱和含氮化合物的莫尔浓度比为1：2，接着添加氯化金属至离子液体，并搅拌添加有氯化金属的离子液体，氯化金属添加至离子液体的莫尔浓度范围在0.005M至0.5M之间。最后，添加生物菌及无机酸剂至具有氯化金属的离子液体，并搅拌添加有生物菌及无机酸剂的离子液体，生物菌添加至离子液体的重量百分比范围在7wt％至11wt％之间，无机酸剂添加至离子液体的莫尔浓度范围在0.7M至2M之间，以得到本发明的无污染电镀液。