Ultrasonic bonding jig, bonding structure, and bonding method

• Main Authors: MIYASHIRO HIROSHI, SURUGA YOICHI, KOYANO SHUHEI
• Format: Patent
• Language: Chinese; English
• Published: 15.01.2019
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The invention provides a ultrasonic bonding jig, a bonding structure, and a bonding method. The ultrasonic bonding jig includes: a base; and a protrusion portion which has a protrusion portion end surface approximately parallel to the base and which has a pair of first walls, the pair of first walls being disposed upright approximately perpendicular to the base from opposed sides of the protrusionportion end surface. The bonding structure includes a bonding portion of a metal plate and a base material. The bonding portion has a recessed portion with a closed bottom on a surface of the metal plate, and the recessed portion has a pair of walls approximately perpendicular to the surface of the metal plate. 本发明提供超声波连接夹具、连接结构和连接方法。所述超声波连接夹具包括：基部；以及突起部，具有与所述基部大体平行的突起部端面和从所述突起部端面的相对的边以相对于所述基部大体垂直的方式竖直设置的对第壁部。所述连接结构具备金属板与基材的连接部，所述连接部在所述金属板的表面具备带底状的凹部，所述凹部具备相对于所述金属板的所述表面大体垂直的对壁部。