Substrate treatment device, method for manufacturing semiconductor device, and recording medium

• Main Authors: YANAGISAWA YOSHIHIKO, HIROCHI YUKITOMO
• Format: Patent
• Language: Chinese; English
• Published: 11.01.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Provided is a technology having: a heating device that heats a substrate using electromagnetic waves; a non-contact-type temperature measuring device that measures the temperature of the substrate; and a control unit, which acquires temperature data measured by the temperature measuring device, and which compares the temperature data with an upper limit temperature and a lower limit temperature, which have been set as threshold values, said control unit performing a control so as to reduce output of the heating device or to turn off a power supply of the heating device, in the cases where thetemperature data is higher than the upper limit temperature or the temperature data is lower than the lower limit temperature. Consequently, an electromagnetic wave heat treatment technology whereby deformation or breakage of the substrate can be suppressed can be provided. 本发明提供种技术，具有：加热装置，其使用电磁波对基板进行加热；非接触式温度测量装置，其测量上述基板的温度；控制部，其获取由上述温度测量装置测量出的温度数据，并进行上述温度数据与预先设定的作为阈值的上限温度和下限温度的比较，在上述温度数据高于上述上限温度的情况下，或者，上述温度数据低于上述下限温度的情