HEAT FLOW MEASUREMENT DEVICE

• Main Authors: GOUKO NORIO, TANIGUCHI TOSHIHISA, SHIRAISHI YOSHIHIKO, ASANO MASAHIRO, OKAMOTO KEIJI, SAKAIDA ATUSI
• Format: Patent
• Language: Chinese; English
• Published: 11.01.2019
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; MEASURING QUANTITY OF HEAT; MEASURING TEMPERATURE; PHYSICS; TESTING; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR

The invention provides a heat flow measurement device. The heat flow measurement device 1 is provided with a heat flux sensor 10 and a thermocouple sheet 200. The heat flux sensor 10 comprises an insulating base material 100, a plurality of interlayer connection members 130, 140, a front surface wiring pattern 111, a back surface wiring pattern 121, a front surface protection member 110, and a back surface protection member 120. The thermocouple sheet 200 comprises a thermocouple 20, a first insulating sheet 210, and a second insulating sheet 220, and is fixed at position where the front surface protection member 110 and the back surface protection member 120 extend from the insulating base material 100 in the planar direction. 本发明提供种热流测定装置。热流测定装置(1)具备热通量传感器(10)以及热电偶片(200)。热通量传感器(10)具有：绝缘基材(100)、多个层间连接部件(130、140)、表面布线图案(111)、背面布线图案(121)、表面保护部件(110)以及背面保护部件(120)。热电偶片(200)具有热电偶(20)、第绝缘片(210)以及第二绝缘片(220)，并被固定于表面保护部件(110)与背面保护部件(120)从绝缘基材(100)向面方向延伸的位置。