Round rod workpiece film plating equipment and film plating technology thereof

• Main Author: FU SHIYI
• Format: Patent
• Language: Chinese; English
• Published: 11.01.2019
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention relates to the field of special light source production manufacturing, in particular to a main machining mode. The mode comprises the steps that a workpiece is clamped to a lathe at first, the number of revolutions is designed, then, a tungsten bar is heated through electric heat conduction so that an S pipe can be uniformly plated onto the tungsten bar, and the tungsten bar is not damaged; uniform film plating of the tungsten bar is achieved in the rotation mode, and meanwhile, impurities and bubbles of a plated film are decreased; and after the cooling technology, the product quality is the highest. By adopting the function of rotation equipment, uniform film plating can be achieved in the tungsten bar film plating project, the impurity and bubble phenomena of the plated film are decreased, meanwhile, the tungsten bar is heated through electric heat conduction so that the S pipe can be uniformly plated onto the tungsten bar, the purpose that the tungsten bar is not damaged is achieved, and aft