Metal mesh touch film electronic blackboard for realizing full bonding
The invention discloses a method for realizing full bonding of a metal mesh touch film electronic blackboard, which comprises the following steps of: a stable self-capacitance is formed by adding an isolation ground wire between a receiving tail-flick lead and a transmitting tail-flick lead and outs...
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| Main Authors | , |
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| Format | Patent |
| Language | Chinese English |
| Published |
04.01.2019
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| Subjects | |
| Online Access | Get full text |
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| Summary: | The invention discloses a method for realizing full bonding of a metal mesh touch film electronic blackboard, which comprises the following steps of: a stable self-capacitance is formed by adding an isolation ground wire between a receiving tail-flick lead and a transmitting tail-flick lead and outside the receiving tail-flick lead to form an initial stable self-capacitance; adding power filter: adding single-phase three-section power filter to the power input port of the electronic blackboard; sensitivity debugging: setting the appropriate touch sensitivity with EasyTune software. A stabilizeself-capacitor, increase power filter and sensitivity debugging process, The invention effectively solves the problem that the electronic blackboard of the existing metal mesh sensor can not realizefull bonding, and makes the touch control film substrate of the electronic blackboard and the display panel realize stable and effective touch control under the condition of full bonding, and the clarity and brightness of the |
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| Bibliography: | Application Number: CN20171452952 |