Mold and method for measuring linear shrinkage rate of sealing glue

• Main Authors: ZHANG BIHONG, LIU JINLONG, ZHAO CUIFENG, XIN ZHIYONG
• Format: Patent
• Language: Chinese; English
• Published: 04.01.2019
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; PHYSICS; TESTING

The invention belongs to the field of application of sealing glue and particularly relates to a mold and method for measuring the linear shrinkage rate of the sealing glue. The mold for measuring thelinear shrinkage rate of the sealing glue includes a baseplate and four side plates; every two side plates are arranged opposite to each other, and the side plates define a glue injection groove; thebaseplate is horizontally arranged at the bottoms of the side plates; a first groove and a second groove are horizontally formed in the surface of the baseplate at an interval. The invention also provides the method for measuring the linear shrinkage rate of the sealing glue. According to the method, the sealing glue is injected into the mold; after the sealing glue is solidified, the spacing between two bosses in the sealing glue is measured, and the linear shrinkage rate is obtained by means of a preset formula. The provided mold and method for measuring the linear shrinkage rate of the sealing glue solve the technic