SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

• Main Authors: OGAWA TAKAHISA, FUKURA MITSUNORI
• Format: Patent
• Language: Chinese; English
• Published: 21.12.2018
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; TESTING

This semiconductor device is provided with: first and second inspection mark regions (51a, 51b) having same patterns, each of which includes a plurality of superposition inspection marks (61a, 61b); afirst element region (52) having a part that overlaps the first inspection mark region (51a); and a second element region (53) having a part that overlaps the second inspection mark region (51b). Thefirst and second element regions (52, 53) are adjacent to each other and have different areas. The first element region (52) has a first pattern aligned with the first superposition inspection marks(61a). The second element region (53) has a second pattern aligned with the second superposition inspection marks (61b). 半导体装置具备：包含多个重叠检査标记(61a、61b)的相同图案的第、第二检査标记区域(51a、51b)；具有与第检査标记区域(51a)重叠的部分的第元件区域(52)；以及具有与第二检査标记区域(51b)重叠的部分的第二元件区域(53)。第、第二元件区域(52、53)相邻接且具有不同的面积。第元件区域(52)具有对准多个第重叠检査标记(61a)的第图案。第二元件区域(53)具有对准多个第二重叠检査标记(61b)的第二图案。