Negative type photosensitive composition curable at low temperature

• Main Authors: TANIGUCHI KATSUTO, MISUMI MOTOKI, KUZAWA MASAHIRO, YOKOYAMA DAISHI
• Format: Patent
• Language: Chinese; English
• Published: 21.12.2018
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

To provide a negative type photosensitive composition developable with a low concentration alkali developer and capable of forming a cured film excellent in transparency, in chemical resistance and inenvironmental durability; and further to provide a pattern-formation method employing the composition. The present invention provides a negative type photosensitive composition comprising : (I) an alkali-soluble resin, namely, a polymer comprising a carboxyl-containing polymerization unit and an alkoxysilyl-containing polymerization unit, (II) a polysiloxane, (III) a compound having two or more (meth)acryloyloxy groups, (IV) (i) a silicone derivative having a particular structure and/or (ii) a compound having two or more epoxy groups, (V) a polymerization initiator, and (VI) a solvent. 提供种负型感光性组合物，所述负型感光性组合物可利用低浓度碱显影液进行显影，可低温固化，并且可获得透明性、耐化学品性、耐环境性高的固化膜，还提供种使用该组合物的图案形成方法。本发明提供种负型感光性组合物，其包含以下成分：(I)碱可溶性树脂，其为包含有包含羧基的聚合单元与包含烷氧基甲硅烷基的聚合单元的聚合物，(II)聚硅氧烷，(III)包含2个以上的(甲基)丙烯酰氧基的化合物，(IV)(i)具有特定的结构的硅树脂衍生物、及/或(ii)包含2个以上的环氧基的化合物