ADHESIVE FORMULATIONS WITH IMPROVED THERMAL AND BONDING PROPERTIES
The present invention refers to a composition comprising: (a) 5-95wt% of a poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature equal to or lower than 30DEG C and a number average molecular weight higher than 15,000 Da; and (b) 95-5 wt% of poly(alkylene...
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Main Authors | , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
21.12.2018
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention refers to a composition comprising: (a) 5-95wt% of a poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature equal to or lower than 30DEG C and a number average molecular weight higher than 15,000 Da; and (b) 95-5 wt% of poly(alkylene carbonate), wherein said poly(alkylene carbonate) has a glass transition temperature higher than 30DEG C. It also refers to a method for producing said composition as well as to its use for preparing adhesive formulations with improved thermal stability and adhesion properties.
本发明涉及种组合物,其包含:(a)5-95wt%的聚(碳酸亚烃酯),其中所述聚(碳酸亚烃酯)的玻璃化转变温度等于或低于30℃并且数均分子量高于15,000Da;和(b)95-5wt%的聚(碳酸亚烃酯),其中所述聚(碳酸亚烃酯)的玻璃化转变温度高于30℃。它还涉及生产所述组合物的方法以及其用于制备具有改善的热稳定性和粘合性能的粘合剂制剂的用途。 |
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Bibliography: | Application Number: CN201780028444 |