Low Pollution Conductive Silver Paste
The invention relates to the technical field of silver paste, in particular to a low-pollution conductive silver paste. Comprises the following components in parts by mass: flake silver powder 60-72%,nanometer silver powder 1-10%, thermoplastic polyimide resin 14-19%, 30%-50% of sodium alginate and...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
18.12.2018
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to the technical field of silver paste, in particular to a low-pollution conductive silver paste. Comprises the following components in parts by mass: flake silver powder 60-72%,nanometer silver powder 1-10%, thermoplastic polyimide resin 14-19%, 30%-50% of sodium alginate and 0. 6%-1% of triterpenoid saponin. The invention has the advantages of unique design, reasonable composition, convenient preparation, excellent electric conductivity and very low pollution.
本发明涉及银浆的技术领域,尤其涉及种低污染型导电银浆。包括以下质量份的组分:片状银粉60-72%、纳米级银粉1-10%、热可塑性聚酰亚胺树脂14-19%、海藻酸钠30%~50%和三萜皂苷0.6-1%。本发明设计独特,组成合理,制备方便,具有优异的导电性能,并且非常低污染。 |
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Bibliography: | Application Number: CN20181902173 |